Assuming next-generation graphics cards draw more power than their predecessors, you could end up having a hard time cooling your graphics cards. So look at the RTX 4090, it’s already huge. Our PC case for him doesn’t get much better than this. But cooling isn’t just about getting bigger and bigger heatsinks.At Computex 2023, MSI showed off some concepts he’s considering that could lower GPU temperatures by as much as 10 degrees.
The first new cooling method is called dynamic bimetallic fins, which are essentially fin sandwiches. So to speak, the bread is made of two aluminum plates, and the delicious bean paste is a copper plate. The combined fin thickness will end up around 1mm, roughly 3-4 times thicker than a regular single fin, but the metal mix will help dissipate heat, according to MSI. The temperature drops by 3°C.
The only drawback is the cost of such creation. 3x fins, 3x materials. Needless to say, more complex processes can be more expensive to manufacture. However, MSI said that in theory you could still get decent temperatures with a much smaller heatsink than the usual aluminum heatsinks found on today’s graphics cards.
The next concept was to use a TEC (thermoelectric cooler) called Arctic Blast. A TEC plate covers the GPU and memory, and a liquid coolant transfers heat to the radiator. Dealing with condensation, which tends to occur with this type of cooler, is a potential problem, CPU TEC block It can be rosy because it handles the part pretty well. Instead, this option offers benefits from temperatures below ambient. This is better than any heatsink can manage, but it requires a lot of power to operate.
MSI cites several advantages of the TEC design. It’s high cooling capacity and overclocking potential in a small form factor. I have to say that I am very intrigued by the concept, but I doubt it will ever be affordable if it does hit the market. TEC blocks aren’t cheap, and neither are graphics cards. No doubt this is a very expensive combination.
A cheaper and more likely option is the 3D vapor chamber. MSI calls them MSI DynaVC. It’s basically the graphics card’s vapor chamber and heat pipe folded into one, no soldering required. According to MSI, this shortens the heat transfer distance, allowing heat to move more efficiently between the main GPU base and the heat pipes.
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The only problem is that MSI told me that initial tests haven’t yet shown a noticeable improvement in heat with the new 3D vapor chamber, but they’re still investigating the feasibility of the concept. is.
Then there’s FusionChill. It’s a concept reimagined in a smaller, sleeker version of today’s few high-end all-in-one cooled graphics cards. A FusionChill is basically a liquid-cooled GPU with all parts inside the graphics card shroud (including the radiator, which is usually connected via tubes in today’s cards).
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The key to the FushionChill is an advanced radiator with a deeper, increased fin pitch. MSI expects the end result to be the coolest among the aforementioned concepts, which equates to a 10 degree Celsius drop.
The important thing to remember is that, in theory, some of these designs are combined into a single graphics card. MSI said they welcomed the idea, so I think the dynamic bimetallic fins and the 3D vapor chamber could work together. When asked if MSI plans to use any of these designs for its next-gen consoles, a company representative declined to answer. It’s just that you can reduce the size of your existing shrouds or use them for even more powerful cards.
Graphics cards are getting bigger, more powerful, and consuming more power, so at some point GPU manufacturers may get more creative with how they cool their graphics cards. yeah. These are just concepts at the moment, but perhaps one of these options will become a little more mainstream.
Perhaps the MSI TEC RTX 5090?
